Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 970

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2360MHz HiSilicon Kirin 970. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.3318 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 29.8GB/s)

Tinggi Frekuensi (2995MHz vs 2360MHz)

Proses pembuatan yang lebih moden (5nm vs 10nm)

Penggunaan kuasa lebih rendah (8W berbanding 9W)

Dikeluarkan lewat 3 tahun dan 9 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +135%

836957

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +218%

1230

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +174%

3778

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 888 Plus +459%

1853

HiSilicon Kirin 970

331

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 970

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2995 MHz

Frekuensi

2360 MHz

8

Teras

8

1 MB

Cache L2

2 MB

0

Cache L3

0

5 nm

Proses

10 nm

10.3

Bilangan transistor

5.5

8 W

TDP

9 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G72 MP12

905 MHz

Frekuensi GPU

768 MHz

2

Unit pelaksanaan

12

512

Unit pewarnaan

18

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

4x 16 Bit

51.2 Gbit/s

Lebar jalur maks

29.8 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

Yes

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

Yes

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.1

3840 x 2160

Resolusi paparan maks

3120 x 1440

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Rakaman video

4K at 30FPS

8K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

32 bit@384 kHz, HD-audio

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 1200 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Diumumkan

Sep 2017

Flagship

Kelas

Flagship

SM8350-AC

Nombor model

Hi3670

Qualcomm Snapdragon 888 Plus

Halaman rasmi

HiSilicon Kirin 970

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

2

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

4

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

5

Qualcomm Snapdragon 8 Gen 3 vs Qualcomm Snapdragon 888 Plus

6

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 888 Plus

7

MediaTek Helio G99 vs HiSilicon Kirin 970

8

MediaTek Dimensity 8300 vs HiSilicon Kirin 970

9

Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 950

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 630