Qualcomm Snapdragon 888 Plus vs HiSilicon Kirin 970

VS

Qualcomm Snapdragon 888 Plus HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 888 Plus Advantages

Better graphics card performance FLOPS (1.8534 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (51.2GB/s vs 29.8GB/s)

Higher Frequency (2995MHz vs 2360MHz)

More modern manufacturing process (5nm vs 10nm)

Lower TDP (8W vs 9W)

Released 3 years and 9 months late

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 888 Plus +135%

836957

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +218%

1230

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +174%

3778

HiSilicon Kirin 970

1377

FP32 (float)

Qualcomm Snapdragon 888 Plus +459%

1853

HiSilicon Kirin 970

331

Qualcomm Snapdragon 888 Plus

VS

HiSilicon Kirin 970

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2995 MHz

Frequency

2360 MHz

8

Cores

8

1 MB

L2 cache

2 MB

0

L3 cache

0

5 nm

Process

10 nm

10.3

Transistor count

5.5

8 W

TDP

9 W

Samsung

Manufacturing

TSMC

Graphics

Adreno 660

GPU name

Mali-G72 MP12

905 MHz

GPU frequency

768 MHz

2

Execution units

12

512

Shading units

18

24

Max size

8

1.8534 TFLOPS

FLOPS

0.3318 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

29.8 Gbit/s

AI

Hexagon 780

NPU

Yes

Multimedia (ISP)

Hexagon 780

Neural processor (NPU)

Yes

UFS 3.0, UFS 3.1

Storage type

UFS 2.1

3840 x 2160

Max display resolution

3120 x 1440

1x 200MP, 2x 25MP

Max camera resolution

1x 48MP, 2x 20MP

8K at 30FPS, 4K at 120FPS

Video capture

4K at 30FPS

8K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

X60

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 18

Yes

5G support

No

Up to 7500 Mbps

Download speed

Up to 1200 Mbps

Up to 3000 Mbps

Upload speed

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

Jun 2021

Announced

Sep 2017

Flagship

Class

Flagship

SM8350-AC

Model number

Hi3670

Qualcomm Snapdragon 888 Plus

Official page

HiSilicon Kirin 970

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