MediaTek Dimensity 8300 vs HiSilicon Kirin 970

VS

MediaTek Dimensity 8300 HiSilicon Kirin 970

Kami membandingkan dua versi SoC telefon: 8 teras 3350MHz MediaTek Dimensity 8300 vs. 8 teras 2360MHz HiSilicon Kirin 970. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

MediaTek Dimensity 8300 Kelebihan

Lebar jalur memori yang lebih besar (68.2GB/s vs 29.8GB/s)

Tinggi Frekuensi (3350MHz vs 2360MHz)

Proses pembuatan yang lebih moden (4nm vs 10nm)

Dikeluarkan lewat 6 tahun dan 2 bulan

Skor

Penanda Aras

AnTuTu 10

MediaTek Dimensity 8300 +335%

1549153

HiSilicon Kirin 970

355946

Geekbench 6 Single Core

MediaTek Dimensity 8300 +290%

1506

HiSilicon Kirin 970

386

Geekbench 6 Multi Core

MediaTek Dimensity 8300 +251%

4844

HiSilicon Kirin 970

1377

MediaTek Dimensity 8300

VS

HiSilicon Kirin 970

CPU

1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510

Seni bina

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

3350 MHz

Frekuensi

2360 MHz

8

Teras

8

-

Cache L2

2 MB

0

Cache L3

0

4 nm

Proses

10 nm

-

Bilangan transistor

5.5

-

TDP

9 W

TSMC

Pembuatan

TSMC

Grafik

Mali-G615 MP6

Nama GPU

Mali-G72 MP12

1400 MHz

Frekuensi GPU

768 MHz

6

Unit pelaksanaan

12

-

Unit pewarnaan

18

24

Saiz maks

8

-

FLOPS

0.3318 TFLOPS

1.3

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

-

Versi DirectX

12

Memori

LPDDR5X

Jenis memori

LPDDR4X

4266 MHz

Frekuensi memori

1866 MHz

4x 16 Bit

Bas

4x 16 Bit

68.2 Gbit/s

Lebar jalur maks

29.8 Gbit/s

AI

MediaTek APU 780

Pemproses neural (NPU)

Yes

Multimedia (ISP)

MediaTek APU 780

Pemproses neural (NPU)

Yes

UFS 4.0

Jenis storan

UFS 2.1

2960 x 1440

Resolusi paparan maks

3120 x 1440

1x 320MP

Resolusi kamera maks

1x 48MP, 2x 20MP

4K at 60FPS

Rakaman video

4K at 30FPS

4K at 60FPS

Main balik video

4K at 30FPS

H.264, H.265, AV1, VP9

Codec video

H.264, H.265, VP8, VP9, VC-1

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Codec audio

32 bit@384 kHz, HD-audio

Kesambungan

-

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

No

Up to 7900 Mbps

Kelajuan muat turun

Up to 1200 Mbps

Up to 4200 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.4

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo

Info

Nov 2023

Diumumkan

Sep 2017

Flagship

Kelas

Flagship

-

Nombor model

Hi3670

MediaTek Dimensity 8300

Halaman rasmi

HiSilicon Kirin 970

Perbandingan SoC Berkaitan

1

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2

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3

MediaTek Dimensity 7200 Ultra vs MediaTek Dimensity 8300

4

MediaTek Dimensity 8300 vs Qualcomm Snapdragon 8 Gen 3

5

Qualcomm Snapdragon 8s Gen 3 vs MediaTek Dimensity 8300

6

MediaTek Dimensity 8300 vs MediaTek Dimensity 9000

7

Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Dimensity 8300

8

MediaTek Helio G99 vs HiSilicon Kirin 970

9

MediaTek Dimensity 8300 vs Samsung Exynos 8895

10

MediaTek Dimensity 8300 vs Qualcomm Snapdragon 480 Plus