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MediaTek Dimensity 8100

MediaTek Dimensity 8100
这是一款采用了台积电 5nm工艺的处理器，上市时间为2022年3月1日。采用了8核心设计，频率为2850MHz，TDP为6W，集成了Mali-G610 MP6核显。

处理器

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架构
4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
主频
2850 MHz
核心数
8
指令集
ARMv8.2-A
3级缓存
0
制程
5 nm
TDP功耗
6 W
制造厂
TSMC

显卡

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显卡型号
Mali-G610 MP6
主频
860 MHz
执行单元
6
FLOPS
1.309 TFLOPS
Vulkan 版本
1.3
OpenCL 版本
2.0
DirectX 版本
12
FLOPS
1309 GFLOPS

内存

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内存类型
LPDDR5
内存频率
3200 MHz
总线
4x 16 Bit
最大带宽
51.2 Gbit/s

多媒体

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神经网络处理器 (NPU)
Yes
存储类型
UFS 3.1
最大显示分辨率
2960 x 1440
最大相机分辨率
1x 200MP
视频拍摄
4K at 60FPS
视频播放
4K at 60FPS
视频编码
H.264, H.265, AV1, VP9
音频编码
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

网络

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4G网络
LTE Cat. 21
5G网络
Yes
下载速度
Up to 4700 Mbps
上传速度
Up to 2500 Mbps
Wi-Fi
6
蓝牙
5.3
导航定位
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

其他信息

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发行日期
2022年3月
级别
Flagship
型号
MT6895Z/TCZA
官网链接
MediaTek Dimensity 8100

排行榜

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安兔兔 10
HiSilicon Kirin 9000S
HiSilicon Kirin 9000S 8C @ 2620 MHz
903932
MediaTek Dimensity 8200
MediaTek Dimensity 8200 8C @ 3100 MHz
903370
Qualcomm Snapdragon 7 Gen 3
Qualcomm Snapdragon 7 Gen 3 8C @ 2630 MHz
866863
MediaTek Dimensity 8100
MediaTek Dimensity 8100 8C @ 2850 MHz
860129
Qualcomm Snapdragon 888 Plus
Qualcomm Snapdragon 888 Plus 8C @ 2995 MHz
836957
Apple A13 Bionic
Apple A13 Bionic 6C @ 2650 MHz
811843
Qualcomm Snapdragon 870
Qualcomm Snapdragon 870 8C @ 3200 MHz
810488
Geekbench 6 单核
Samsung Exynos 1480
Samsung Exynos 1480 8C @ 2750 MHz
1168
Qualcomm Snapdragon 865 Plus
Qualcomm Snapdragon 865 Plus 8C @ 3100 MHz
1163
Qualcomm Snapdragon 870
Qualcomm Snapdragon 870 8C @ 3200 MHz
1151
MediaTek Dimensity 8100
MediaTek Dimensity 8100 8C @ 2850 MHz
1145
Qualcomm Snapdragon 7 Gen 3
Qualcomm Snapdragon 7 Gen 3 8C @ 2630 MHz
1139
HiSilicon Kirin 9000E 5G
HiSilicon Kirin 9000E 5G C @
1137
MediaTek Dimensity 7200 Ultra
MediaTek Dimensity 7200 Ultra 8C @ 2800 MHz
1134
Geekbench 6 多核
Qualcomm Snapdragon 888 Plus
Qualcomm Snapdragon 888 Plus 8C @ 2995 MHz
3778
MediaTek Dimensity 8020
MediaTek Dimensity 8020 8C @ 2600 MHz
3709
Samsung Exynos 2200
Samsung Exynos 2200 8C @ 2800 MHz
3685
MediaTek Dimensity 8100
MediaTek Dimensity 8100 8C @ 2850 MHz
3633
HiSilicon Kirin 9000
HiSilicon Kirin 9000 8C @ 3130 MHz
3529
Samsung Exynos 1480
Samsung Exynos 1480 8C @ 2750 MHz
3503
Google Tensor G2
Google Tensor G2 8C @ 2850 MHz
3468
FP32浮点性能
MediaTek Dimensity 8200
MediaTek Dimensity 8200 8C @ 3100 MHz
1442
Qualcomm Snapdragon 865 Plus
Qualcomm Snapdragon 865 Plus 8C @ 3100 MHz
1372
Qualcomm Snapdragon 870
Qualcomm Snapdragon 870 8C @ 3200 MHz
1372
MediaTek Dimensity 8000
MediaTek Dimensity 8000 8C @ 2750 MHz
1309
MediaTek Dimensity 8100
MediaTek Dimensity 8100 8C @ 2850 MHz
1309
Qualcomm Snapdragon 865
Qualcomm Snapdragon 865 8C @ 2840 MHz
1202
Google Tensor G2
Google Tensor G2 8C @ 2850 MHz
1142

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