Qualcomm Snapdragon 870 vs MediaTek Dimensity 7050

VS

Qualcomm Snapdragon 870 MediaTek Dimensity 7050

We compared two versions of phone SoCs: 8 cores 3200MHz Qualcomm Snapdragon 870 vs. 8 cores 2600MHz MediaTek Dimensity 7050 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 870Advantages

Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.686 TFLOPS )

Higher Frequency (3200MHz vs 2600MHz)

MediaTek Dimensity 7050Advantages

More modern manufacturing process (6nm vs 7nm)

Lower TDP (4W vs 6W)

Published 2 years 4 months later

Score

Benchmark

AnTuTu 10

Qualcomm Snapdragon 870 +51%

810488

MediaTek Dimensity 7050

535270

Geekbench 6 Single Core

Qualcomm Snapdragon 870 +19%

1151

MediaTek Dimensity 7050

962

Geekbench 6 Multi Core

Qualcomm Snapdragon 870 +41%

3336

MediaTek Dimensity 7050

2364

FP32 (float)

Qualcomm Snapdragon 870 +100%

1372

MediaTek Dimensity 7050

686

Qualcomm Snapdragon 870

VS

MediaTek Dimensity 7050

CPU

1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)

Architecture

2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

3200 MHz

Frequency

2600 MHz

8

Cores

8

1 MB

L2 cache

-

0

L3 cache

-

7 nm

Process

6 nm

10.3

Transistor count

-

6 W

TDP

4 W

TSMC

Manufacturing

TSMC

Graphics

Adreno 650

GPU name

Mali-G68 MP4

670 MHz

GPU frequency

800 MHz

2

Execution units

4

512

Shading units

-

16

Max size

16

1.3721 TFLOPS

FLOPS

0.686 TFLOPS

1.1

Vulkan version

1.3

2.0

OpenCL version

2.0

12.1

DirectX version

-

Memory

LPDDR5

Memory type

LPDDR5

2750 MHz

Memory frequency

3200 MHz

4x 16 Bit

Bus

4x 16 Bit

44 Gbit/s

Max bandwidth

-

AI

Hexagon 698

NPU

MediaTek APU 550

Multimedia (ISP)

Hexagon 698

Neural processor (NPU)

MediaTek APU 550

UFS 3.0, UFS 3.1

Storage type

UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1

3840 x 2160

Max display resolution

2520 x 1080

1x 200MP, 2x 25MP

Max camera resolution

1x 200MP

8K at 30FPS, 4K at 60FPS

Video capture

4K at 30FPS

8K at 30FPS, 4K at 60FPS

Video playback

4K at 30FPS

H.264, H.265, VP8, VP9

Video codecs

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

X55

Modem

-

Connectivity

LTE Cat. 22

4G support

LTE Cat. 18

Yes

5G support

Yes

Up to 7500 Mbps

Download speed

Up to 2770 Mbps

Up to 3000 Mbps

Upload speed

Up to 1250 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.2

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jan 2021

Announced

May 2023

Flagship

Class

Mid range

SM8250-AC

Model number

MT6877 MT6877V/TTZA

Qualcomm Snapdragon 870

Official page

MediaTek Dimensity 7050

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