Home Qualcomm Snapdragon 888 Plus

Qualcomm Snapdragon 888 Plus

Qualcomm Snapdragon 888 Plus
This is a processor manufactured using the Samsung 5nm process, announced on June 1, 2021. It features 8 cores, operates at a frequency of 2995MHz, has a TDP of 8W, and integrates the Adreno 660 GPU.

CPU

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Architecture
1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
Frequency
2995 MHz
Cores
8
Instruction set
ARMv8.4-A
L1 cache
L2 cache
1 MB
L3 cache
0
Process
5 nm
Transistor count
10.3
TDP
8 W
Manufacturing
Samsung

Graphics

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GPU name
Adreno 660
GPU frequency
905 MHz
Execution units
2
Shading units
512
FLOPS
1.8534 TFLOPS
Vulkan version
1.1
OpenCL version
2.0
DirectX version
12.1
FLOPS
1853.4 GFLOPS

Memory

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Memory type
LPDDR5
Memory frequency
3200 MHz
Bus
4x 16 Bit
Max bandwidth
51.2 Gbit/s

Multimedia (ISP)

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Neural processor (NPU)
Hexagon 780
Storage type
UFS 3.0, UFS 3.1
Max display resolution
3840 x 2160
Max camera resolution
1x 200MP, 2x 25MP
Video capture
8K at 30FPS, 4K at 120FPS
Video playback
8K at 30FPS
Video codecs
H.264, H.265, VP8, VP9
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV

Connectivity

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4G support
LTE Cat. 22
5G support
Yes
Download speed
Up to 7500 Mbps
Upload speed
Up to 3000 Mbps
Wi-Fi
6
Bluetooth
5.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Info

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Announced
Jun 2021
Class
Flagship
Model number
SM8350-AC

Rankings

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AnTuTu 10
MediaTek Dimensity 8200
903370
Qualcomm Snapdragon 7 Gen 3
866863
MediaTek Dimensity 8100
860129
Qualcomm Snapdragon 888 Plus
836957
Apple A13 Bionic
Apple A13 Bionic 6C @ 2650 MHz
811843
Qualcomm Snapdragon 870
810488
Google Tensor G2
Google Tensor G2 8C @ 2850 MHz
808269
Geekbench 6 Single Core
Apple A12 Bionic
Apple A12 Bionic 6C @ 2490 MHz
1301
HiSilicon Kirin 9000
HiSilicon Kirin 9000 8C @ 3130 MHz
1266
MediaTek Dimensity 1300
1252
Qualcomm Snapdragon 888 Plus
1230
MediaTek Dimensity 8200
1229
MediaTek Dimensity 7200
1192
Google Tensor G2
Google Tensor G2 8C @ 2850 MHz
1188
Geekbench 6 Multi Core
Qualcomm Snapdragon 8 Gen 1
4030
MediaTek Dimensity 8200
3924
Qualcomm Snapdragon 888
3794
Qualcomm Snapdragon 888 Plus
3778
MediaTek Dimensity 8020
3709
Samsung Exynos 2200
Samsung Exynos 2200 8C @ 2800 MHz
3685
MediaTek Dimensity 8100
3633
FP32 (float)
Google Tensor
Google Tensor 8C @ 2800 MHz
2170
Apple A17 Pro
Apple A17 Pro 6C @ 3780 MHz
2147
HiSilicon Kirin 9000E
HiSilicon Kirin 9000E 8C @ 3130 MHz
2137
Qualcomm Snapdragon 888 Plus
1853
MediaTek Dimensity 9000 Plus
1791
Apple A16 Bionic
Apple A16 Bionic 6C @ 3460 MHz
1789

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