Home MediaTek Dimensity 7025

MediaTek Dimensity 7025

MediaTek Dimensity 7025
This is a processor manufactured using the TSMC 6nm process, announced on Apr 2024. It features 8 cores, operates at a frequency of 2500MHz, has a TDP of 0W, and integrates the IMG BXM-8-256 GPU.

CPU

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Architecture
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
Frequency
2500 MHz
Cores
8
Instruction set
ARMv8.2-A
Process
6 nm
Transistor count
10
Manufacturing
TSMC

Graphics

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GPU name
IMG BXM-8-256
GPU frequency
950 MHz
Execution units
8
Shading units
18
Vulkan version
1.3
OpenCL version
3.0

Memory

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Memory type
LPDDR5
Memory frequency
3200 MHz
Bus
4x 16 Bit
Max bandwidth
51.2 Gbit/s

Multimedia (ISP)

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Neural processor (NPU)
Yes
Storage type
UFS 2.2, UFS 3.1
Max display resolution
2520 x 1080
Max camera resolution
1x 200MP
Video capture
2K at 30FPS
Video playback
2K at 30FPS
Video codecs
H.264, H.265, VP9
Audio codecs
AIFF, CAF, MP3, MP4, WAV

Connectivity

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4G support
LTE Cat. 18
5G support
Yes
Download speed
Up to 2770 Mbps
Upload speed
Up to 1250 Mbps
Wi-Fi
5
Bluetooth
5.3
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

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Announced
Apr 2024
Class
Mid range
Official page

Rankings

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AnTuTu 10
MediaTek Dimensity 900
516049
Qualcomm Snapdragon 6s Gen 3
500600
HiSilicon Kirin 820
HiSilicon Kirin 820 8C @ 2360 MHz
498005
MediaTek Dimensity 7025
495066
Unisoc T820
Unisoc T820 8C @ 2700 MHz
492038
MediaTek Dimensity 820
489218
Samsung Exynos 1280
Samsung Exynos 1280 8C @ 2400 MHz
481288
Geekbench 6 Single Core
MediaTek Dimensity 1000 Plus
1040
Qualcomm Snapdragon 855 Plus
1040
MediaTek Dimensity 7025
1024
Qualcomm Snapdragon 7s Gen 2
1012
Samsung Exynos 1380
Samsung Exynos 1380 8C @ 2400 MHz
1000
Qualcomm Snapdragon 860
996
MediaTek Dimensity 1050
995
Geekbench 6 Multi Core
Qualcomm Snapdragon 860
2569
MediaTek Dimensity 7030
2500
MediaTek Dimensity 820
2494
MediaTek Dimensity 7025
2472
MediaTek Dimensity 1050
2440
MediaTek Dimensity 1080
2421
Unisoc T760
Unisoc T760 8C @ 2200 MHz
2390

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