Home MediaTek Dimensity 1050

MediaTek Dimensity 1050

MediaTek Dimensity 1050
This is a processor manufactured using the TSMC 6nm process, announced on May 1, 2022. It features 8 cores, operates at a frequency of 2500MHz, has a TDP of 0W, and integrates the Mali-G610 MP3 GPU.

CPU

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Architecture
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
Frequency
2500 MHz
Cores
8
Instruction set
ARMv8.2-A
Process
6 nm
Manufacturing
TSMC

Graphics

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GPU name
Mali-G610 MP3
GPU frequency
1000 MHz
Execution units
3
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12

Memory

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Memory type
LPDDR5
Memory frequency
3200 MHz
Bus
4x 16 Bit

Multimedia (ISP)

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Neural processor (NPU)
MediaTek APU 550
Storage type
UFS 2.1, UFS 3.1
Max display resolution
2520 x 1080
Max camera resolution
1x 108MP, 2x 20MP
Video capture
4K at 30FPS
Video playback
4K at 30FPS
Video codecs
H.264, H.265, VP9
Audio codecs
AIFF, CAF, MP3, MP4, WAV

Connectivity

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4G support
LTE Cat. 18
5G support
Yes
Download speed
Up to 2770 Mbps
Upload speed
Up to 1250 Mbps
Wi-Fi
6
Bluetooth
5.2
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

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Announced
May 2022
Class
Mid range
Model number
MT6879
Official page

Rankings

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AnTuTu 10
HiSilicon Kirin 980
HiSilicon Kirin 980 8C @ 2600 MHz
583410
Qualcomm Snapdragon 6 Gen 1
582743
Samsung Exynos 2100
Samsung Exynos 2100 8C @ 2900 MHz
567972
MediaTek Dimensity 1050
564464
Qualcomm Snapdragon 855 Plus
552687
MediaTek Dimensity 1080
537997
MediaTek Dimensity 7050
535270
Geekbench 6 Single Core
Qualcomm Snapdragon 7s Gen 2
1002
Samsung Exynos 1380
Samsung Exynos 1380 8C @ 2400 MHz
1000
Qualcomm Snapdragon 860
996
MediaTek Dimensity 1050
995
HiSilicon Kirin 990 4G
990
Qualcomm Snapdragon 778G
981
HiSilicon Kirin 990
HiSilicon Kirin 990 8C @ 2860 MHz
971
Geekbench 6 Multi Core
MediaTek Dimensity 7030
2500
MediaTek Dimensity 820
2494
MediaTek Dimensity 7025
2472
MediaTek Dimensity 1050
2440
MediaTek Dimensity 1080
2421
MediaTek Dimensity 7050
2364
Apple A11 Bionic
Apple A11 Bionic 6C @ 2390 MHz
2357

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