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HiSilicon Kirin 990

HiSilicon Kirin 990
This is a processor manufactured using the TSMC 7nm process, announced on October 1, 2019. It features 8 cores, operates at a frequency of 2860MHz, has a TDP of 6W, and integrates the Mali-G76 MP16 GPU.

CPU

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Architecture
2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55
Frequency
2860 MHz
Cores
8
Instruction set
ARMv8.2-A
L1 cache
L2 cache
2 MB
Process
7 nm
Transistor count
8
TDP
6 W
Manufacturing
TSMC

Graphics

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GPU name
Mali-G76 MP16
GPU frequency
600 MHz
Execution units
16
Shading units
36
FLOPS
0.6912 TFLOPS
Vulkan version
1.3
OpenCL version
2.0
FLOPS
691.2 GFLOPS

Memory

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Memory type
LPDDR4X
Memory frequency
2133 MHz
Bus
4x 16 Bit
Max bandwidth
34.1 Gbit/s

Multimedia (ISP)

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Neural processor (NPU)
Da Vinci
Storage type
UFS 2.1, UFS 3.0
Max display resolution
3360 x 1440
Video capture
4K at 60FPS
Video playback
4K at 60FPS
Video codecs
H.264, H.265, VC-1
Audio codecs
AIFF, CAF, MP3, MP4, WAV

Connectivity

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4G support
LTE Cat. 24
5G support
Yes
Download speed
Up to 4600 Mbps
Wi-Fi
6
Bluetooth
5.0
Navigation
GPS, GLONASS, Beidou

Info

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Announced
Oct 2019
Class
Flagship
Official page

Rankings

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Geekbench 6 Single Core
MediaTek Dimensity 1050
995
HiSilicon Kirin 990 4G
990
Qualcomm Snapdragon 778G
981
HiSilicon Kirin 990
HiSilicon Kirin 990 8C @ 2860 MHz
971
HiSilicon Kirin 990 5G
969
Qualcomm Snapdragon 7 Gen 1
969
MediaTek Dimensity 1080
969
Geekbench 6 Multi Core
MediaTek Dimensity 1200
3198
HiSilicon Kirin 990 4G
3179
HiSilicon Kirin 990 5G
3176
HiSilicon Kirin 990
HiSilicon Kirin 990 8C @ 2860 MHz
3155
MediaTek Dimensity 1000 Plus
3152
Qualcomm Snapdragon 778G Plus
3008
Samsung Exynos 1080
Samsung Exynos 1080 8C @ 2800 MHz
2980
FP32 (float)
Qualcomm Snapdragon 780G
752
Qualcomm Snapdragon 782G
752
Qualcomm Snapdragon 845
727
HiSilicon Kirin 990 4G
691
HiSilicon Kirin 990 5G
691
HiSilicon Kirin 990
HiSilicon Kirin 990 8C @ 2860 MHz
691
MediaTek Dimensity 1080
686

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