MediaTek Dimensity 1300 vs Qualcomm Snapdragon 855 Plus

VS

MediaTek Dimensity 1300 Qualcomm Snapdragon 855 Plus

We compared two versions of phone SoCs: 8 cores 3000MHz MediaTek Dimensity 1300 vs. 8 cores 2960MHz Qualcomm Snapdragon 855 Plus . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 1300 Advantages

Higher Frequency (3000MHz vs 2960MHz)

More modern manufacturing process (6nm vs 7nm)

Released 2 years and 8 months late

Qualcomm Snapdragon 855 Plus Advantages

Better graphics card performance FLOPS (1.0368 TFLOPS vs 0.9792 TFLOPS )

Larger memory bandwidth (34.13GB/s vs 34.1GB/s)

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 1300 +26%

698511

Qualcomm Snapdragon 855 Plus

552687

Geekbench 6 Single Core

MediaTek Dimensity 1300 +20%

1252

Qualcomm Snapdragon 855 Plus

1040

Geekbench 6 Multi Core

MediaTek Dimensity 1300 +20%

3457

Qualcomm Snapdragon 855 Plus

2865

FP32 (float)

MediaTek Dimensity 1300

979

Qualcomm Snapdragon 855 Plus +5%

1036

MediaTek Dimensity 1300

VS

Qualcomm Snapdragon 855 Plus

CPU

1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55

Architecture

1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold)
3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold)
4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver)

3000 MHz

Frequency

2960 MHz

8

Cores

8

-

L2 cache

1 MB

-

L3 cache

0

6 nm

Process

7 nm

-

Transistor count

6.7

-

TDP

6 W

TSMC

Manufacturing

TSMC

Graphics

Mali-G77 MP9

GPU name

Adreno 640

850 MHz

GPU frequency

675 MHz

9

Execution units

2

64

Shading units

384

16

Max size

16

0.9792 TFLOPS

FLOPS

1.0368 TFLOPS

1.3

Vulkan version

1.1

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR4X

2133 MHz

Memory frequency

2133 MHz

4x 16 Bit

Bus

4x 16 Bit

34.1 Gbit/s

Max bandwidth

34.13 Gbit/s

AI

MediaTek APU 3.0

NPU

Hexagon 690

Multimedia (ISP)

MediaTek APU 3.0

Neural processor (NPU)

Hexagon 690

UFS 3.1

Storage type

UFS 3.0

2520 x 1080

Max display resolution

3840 x 2160

1x 200MP

Max camera resolution

1x 192MP, 2x 22MP

4K at 60FPS

Video capture

4K at 120FPS

4K at 60FPS

Video playback

8K at 30FPS, 4K at 120FPS

H.264, H.265, AV1, VP9

Video codecs

H.264, H.265, VP8, VP9

AIFF, CAF, MP3, MP4, WAV

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

Helio M70

Modem

X24 LTE, X50 5G

Connectivity

LTE Cat. 19

4G support

LTE Cat. 20

Yes

5G support

Yes

Up to 4700 Mbps

Download speed

Up to 5000 Mbps

Up to 2500 Mbps

Upload speed

Up to 1240 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Info

Mar 2022

Announced

Jul 2019

Flagship

Class

Flagship

MT6893Z

Model number

SM8150-AC

MediaTek Dimensity 1300

Official page

Qualcomm Snapdragon 855 Plus

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