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Mobile and Tablet SoC Comparison
HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 870
HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 870
VS
HiSilicon Kirin 990 4G
Qualcomm Snapdragon 870
We compared two versions of phone SoCs: 8 cores 2860MHz HiSilicon Kirin 990 4G vs. 8 cores 3200MHz Qualcomm Snapdragon 870 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.
Main Differences
Qualcomm Snapdragon 870 Advantages
Better graphics card performance FLOPS (1.3721 TFLOPS vs 0.6912 TFLOPS )
Larger memory bandwidth (44GB/s vs 34.1GB/s)
Higher Frequency (3200MHz vs 2860MHz)
Released 1 years and 3 months late
Score
Benchmark
AnTuTu 10
HiSilicon Kirin 990 4G
695853
Qualcomm Snapdragon 870
+16%
810488
Geekbench 6 Single Core
HiSilicon Kirin 990 4G
990
Qualcomm Snapdragon 870
+16%
1151
Geekbench 6 Multi Core
HiSilicon Kirin 990 4G
3179
Qualcomm Snapdragon 870
+4%
3336
FP32 (float)
HiSilicon Kirin 990 4G
691
Qualcomm Snapdragon 870
+98%
1372
HiSilicon Kirin 990 4G
VS
Qualcomm Snapdragon 870
CPU
2x 2.86 GHz – Cortex-A76
2x 2.09 GHz – Cortex-A76
4x 1.86 GHz – Cortex-A55
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
2860 MHz
Frequency
3200 MHz
8
Cores
8
2 MB
L2 cache
1 MB
-
L3 cache
0
7 nm
Process
7 nm
8
Transistor count
10.3
6 W
TDP
6 W
TSMC
Manufacturing
TSMC
Graphics
Mali-G76 MP16
GPU name
Adreno 650
600 MHz
GPU frequency
670 MHz
16
Execution units
2
36
Shading units
512
12
Max size
16
0.6912 TFLOPS
FLOPS
1.3721 TFLOPS
1.3
Vulkan version
1.1
2.0
OpenCL version
2.0
12
DirectX version
12.1
Memory
LPDDR4X
Memory type
LPDDR5
2133 MHz
Memory frequency
2750 MHz
4x 16 Bit
Bus
4x 16 Bit
34.1 Gbit/s
Max bandwidth
44 Gbit/s
AI
Da Vinci
NPU
Hexagon 698
Multimedia (ISP)
Da Vinci
Neural processor (NPU)
Hexagon 698
UFS 2.1, UFS 3.0
Storage type
UFS 3.0, UFS 3.1
3360 x 1440
Max display resolution
3840 x 2160
-
Max camera resolution
1x 200MP, 2x 25MP
4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
4K at 60FPS
Video playback
8K at 30FPS, 4K at 60FPS
H.264, H.265, VC-1
Video codecs
H.264, H.265, VP8, VP9
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Balong 765
Modem
X55
Connectivity
LTE Cat. 19
4G support
LTE Cat. 22
No
5G support
Yes
Up to 1400 Mbps
Download speed
Up to 7500 Mbps
Up to 200 Mbps
Upload speed
Up to 3000 Mbps
6
Wi-Fi
6
5.0
Bluetooth
5.2
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Oct 2019
Announced
Jan 2021
Flagship
Class
Flagship
-
Model number
SM8250-AC
HiSilicon Kirin 990 4G
Official page
Qualcomm Snapdragon 870
Related SoC Comparison
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MediaTek Dimensity 8200 vs HiSilicon Kirin 990 4G
2
Samsung Exynos 1480 vs HiSilicon Kirin 990 4G
3
Qualcomm Snapdragon 7s Gen 2 vs HiSilicon Kirin 990 4G
4
HiSilicon Kirin 990 4G vs Qualcomm Snapdragon 7 Gen 1
5
MediaTek Dimensity 9000 vs HiSilicon Kirin 990 4G
6
Qualcomm Snapdragon 6 Gen 1 vs HiSilicon Kirin 990 4G
7
Apple A10 Fusion vs HiSilicon Kirin 990 4G
8
Qualcomm Snapdragon 7s Gen 2 vs Qualcomm Snapdragon 870
9
HiSilicon Kirin 990 4G vs Samsung Exynos 1080
10
HiSilicon Kirin 990 4G vs MediaTek Dimensity 1000 Plus
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