HiSilicon Kirin 970 vs Qualcomm Snapdragon 8 Gen 3

VS

HiSilicon Kirin 970 Qualcomm Snapdragon 8 Gen 3

We compared two versions of phone SoCs: 8 cores 2360MHz HiSilicon Kirin 970 vs. 8 cores 3300MHz Qualcomm Snapdragon 8 Gen 3 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

Qualcomm Snapdragon 8 Gen 3 Advantages

Better graphics card performance FLOPS (4.7308 TFLOPS vs 0.3318 TFLOPS )

Larger memory bandwidth (77GB/s vs 29.8GB/s)

Higher Frequency (3300MHz vs 2360MHz)

More modern manufacturing process (4nm vs 10nm)

Released 6 years and 1 months late

Score

Benchmark

AnTuTu 10

HiSilicon Kirin 970

355946

Qualcomm Snapdragon 8 Gen 3 +484%

2079542

Geekbench 6 Single Core

HiSilicon Kirin 970

386

Qualcomm Snapdragon 8 Gen 3 +465%

2181

Geekbench 6 Multi Core

HiSilicon Kirin 970

1377

Qualcomm Snapdragon 8 Gen 3 +426%

7250

FP32 (float)

HiSilicon Kirin 970

331

Qualcomm Snapdragon 8 Gen 3 +1329%

4730

HiSilicon Kirin 970

VS

Qualcomm Snapdragon 8 Gen 3

CPU

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

Architecture

1x 3.3 GHz – Cortex-X4
3x 3.15 GHz – Cortex-A720
2x 2.96 GHz – Cortex-A720
2x 2.26 GHz – Cortex-A520

2360 MHz

Frequency

3300 MHz

8

Cores

8

2 MB

L2 cache

-

0

L3 cache

0

10 nm

Process

4 nm

5.5

Transistor count

-

9 W

TDP

-

TSMC

Manufacturing

TSMC

Graphics

Mali-G72 MP12

GPU name

Adreno 750

768 MHz

GPU frequency

903 MHz

12

Execution units

2

18

Shading units

1536

8

Max size

24

0.3318 TFLOPS

FLOPS

4.7308 TFLOPS

1.3

Vulkan version

1.3

2.0

OpenCL version

2.0

12

DirectX version

12.1

Memory

LPDDR4X

Memory type

LPDDR5X

1866 MHz

Memory frequency

4800 MHz

4x 16 Bit

Bus

4x 16 Bit

29.8 Gbit/s

Max bandwidth

77 Gbit/s

AI

Yes

NPU

Hexagon

Multimedia (ISP)

Yes

Neural processor (NPU)

Hexagon

UFS 2.1

Storage type

UFS 4.0

3120 x 1440

Max display resolution

3840 x 2160

1x 48MP, 2x 20MP

Max camera resolution

1x 200MP

4K at 30FPS

Video capture

8K at 30FPS, 4K at 120FPS

4K at 30FPS

Video playback

8K at 60FPS, 4K at 120FPS

H.264, H.265, VP8, VP9, VC-1

Video codecs

H.264, H.265, AV1, VP8, VP9

32 bit@384 kHz, HD-audio

Audio codecs

AAC, AIFF, CAF, MP3, MP4, WAV

-

Modem

Snapdragon X75

Connectivity

LTE Cat. 18

4G support

LTE Cat. 24

No

5G support

Yes

Up to 1200 Mbps

Download speed

Up to 10000 Mbps

Up to 150 Mbps

Upload speed

Up to 3500 Mbps

5

Wi-Fi

7

4.2

Bluetooth

5.4

GPS, GLONASS, Beidou, Galileo

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Sep 2017

Announced

Oct 2023

Flagship

Class

Flagship

Hi3670

Model number

SM8650-AB

HiSilicon Kirin 970

Official page

Qualcomm Snapdragon 8 Gen 3

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