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TSMC Advances in Backside Power Supply Technology: Aiming for 2026 Mass Production

kyojuro 7/4/2024

According to media reports, TSMC has proposed a perfect backside power delivery network (BSPDN) solution, although it is complex and costly to implement, and is expected to be mass-produced in 2026.

Currently, TSMC's reliance on the Super Power Rail architecture, known for its superior performance and efficiency, is recognized by the industry as an effective solution to the complex signal transmission and intensive power supply needs of high-performance computing (HPC) products.

The architecture will soon see large-scale adoption on the A16 process, heralding a significant leap in semiconductor performance and energy efficiency. Compared to the traditional N2P process, the Super Rail architecture delivers up to 8-10% performance improvement at the same operating voltage. Conversely, it significantly reduces power consumption by 15-20% while maintaining the same speed and realizing a 1.1x density increase.

It is worth noting that the implementation of backside power supply technology relies on a series of key technological breakthroughs. Among them, the most critical is the fine polishing of the backside of the chip to a thickness sufficient to achieve close contact with the transistor—a process that, while subtle, inevitably weakens the wafer's mechanical strength.

To meet this challenge, TSMC skillfully introduced carrier wafer bonding technology after front-side polishing to firmly support the subsequent backside manufacturing process and ensure smooth progress.

Additionally, the incorporation of cutting-edge technologies such as nanosilicon through-hole (nTSV) has placed higher demands on equipment precision and process control. To ensure the uniform deposition of copper metal within the nanoscale vias, TSMC needs to invest in more high-end equipment to support this precise and complex manufacturing process.

With the gradual mass production of TSMC's Super Rail architecture, it will not only lead a new round of competition in semiconductor performance and energy efficiency but also drive the synergistic development of the entire supply chain upstream and downstream, injecting strong growth momentum into the entire industry.

TSMC Targets Mass Production of Backside Power Supply Technology by 2026

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