MediaTek Dimensity 810

This is a processor manufactured using the TSMC 6nm process, announced on August 1, 2021. It features 8 cores, operates at a frequency of 2400MHz, has a TDP of 6W, and integrates the Mali-G57 MP2 GPU.

CPU

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Architecture

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

Frequency

2400 MHz

Cores

8

Instruction set

ARMv8.2-A

L1 cache

L2 cache

1 MB

L3 cache

0

Process

6 nm

Transistor count

12

TDP

6 W

Manufacturing

TSMC

Graphics

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GPU name

Mali-G57 MP2

GPU frequency

950 MHz

Execution units

2

Shading units

64

FLOPS

0.243 TFLOPS

Vulkan version

1.3

OpenCL version

2.0

DirectX version

12

FLOPS

243 GFLOPS

Memory

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Memory type

LPDDR4X

Memory frequency

2133 MHz

Bus

2x 16 Bit

Max bandwidth

17.07 Gbit/s

Multimedia (ISP)

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Neural processor (NPU)

MediaTek APU 3.0

Storage type

UFS 2.2

Max display resolution

2520 x 1080

Max camera resolution

1x 64MP, 2x 16MP

Video capture

2K at 30FPS

Video playback

2K at 30FPS

Video codecs

H.264, H.265, VP9

Audio codecs

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

Connectivity

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4G support

LTE Cat. 18

5G support

Yes

Download speed

Up to 2770 Mbps

Upload speed

Up to 1250 Mbps

Wi-Fi

5

Bluetooth

5.1

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

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Announced

Aug 2021

Class

Mid range

Model number

MT6833V

Official page

MediaTek Dimensity 810

Rankings

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AnTuTu 10

Qualcomm Snapdragon 750G 8C @ 2200 MHz

441755

MediaTek Dimensity 800U 8C @ 2400 MHz

434499

Samsung Exynos 980 8C @ 2200 MHz

433794

MediaTek Dimensity 810 8C @ 2400 MHz

433200

Qualcomm Snapdragon 4 Gen 1 8C @ 2000 MHz

431521

Qualcomm Snapdragon 4 Gen 2 8C @ 2200 MHz

428143

Samsung Exynos 1330 8C @ 2400 MHz

427116

Geekbench 6 Single Core

MediaTek Dimensity 6300 8C @ 2400 MHz

813

Qualcomm Snapdragon 765G 8C @ 2400 MHz

801

Qualcomm Snapdragon 690 8C @ 2000 MHz

797

MediaTek Dimensity 810 8C @ 2400 MHz

787

Qualcomm Snapdragon 690 5G C @

780

HiSilicon Kirin 810 8C @ 2270 MHz

778

MediaTek Dimensity 720 8C @ 2000 MHz

774

Geekbench 6 Multi Core

MediaTek Helio G99 8C @ 2200 MHz

1994

HiSilicon Kirin 810 8C @ 2270 MHz

1992

MediaTek Dimensity 6100 Plus 8C @ 2200 MHz

1965

MediaTek Dimensity 810 8C @ 2400 MHz

1945

MediaTek Dimensity 6020 8C @ 2200 MHz

1941

Samsung Exynos 1280 8C @ 2400 MHz

1927

Qualcomm Snapdragon 690 8C @ 2000 MHz

1900

FP32 (float)

Apple A10 Fusion 4C @ 2340 MHz

249

Samsung Exynos 8890 8C @ 2300 MHz

249

Apple A9 2C @ 1850 MHz

249

MediaTek Dimensity 700 8C @ 2200 MHz

243

Qualcomm Snapdragon 662 8C @ 2000 MHz

243

Qualcomm Snapdragon 665 8C @ 2000 MHz

243

MediaTek Dimensity 810 8C @ 2400 MHz

243

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