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MediaTek Dimensity 900

MediaTek Dimensity 900
这是一款采用了台积电 6nm工艺的处理器，上市时间为2021年5月1日。采用了8核心设计，频率为2400MHz，TDP为4W，集成了Mali-G68 MP4核显。

处理器

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架构
2x 2.4 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
主频
2400 MHz
核心数
8
指令集
ARMv8.2-A
3级缓存
0
制程
6 nm
晶体管数
10
TDP功耗
4 W
制造厂
TSMC

显卡

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显卡型号
Mali-G68 MP4
主频
900 MHz
执行单元
4
着色单元
48
FLOPS
0.621 TFLOPS
Vulkan 版本
1.3
OpenCL 版本
2.0
DirectX 版本
12
FLOPS
621 GFLOPS

内存

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内存类型
LPDDR5
内存频率
3200 MHz
总线
4x 16 Bit
最大带宽
18.4 Gbit/s

多媒体

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神经网络处理器 (NPU)
Yes
存储类型
UFS 2.1, UFS 3.1
最大显示分辨率
2520 x 1080
最大相机分辨率
1x 108MP, 2x 20MP
视频拍摄
4K at 30FPS
视频播放
4K at 30FPS
视频编码
H.264, H.265, AV1, VP9
音频编码
AAC, AIFF, CAF, MP3, MP4, WAV

网络

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4G网络
LTE Cat. 18
5G网络
Yes
下载速度
Up to 2770 Mbps
上传速度
Up to 1250 Mbps
Wi-Fi
6
蓝牙
5.2
导航定位
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

其他信息

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发行日期
2021年5月
级别
Mid range
型号
MT6877
官网链接
MediaTek Dimensity 900

排行榜

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安兔兔 10
MediaTek Dimensity 920
MediaTek Dimensity 920 8C @ 2500 MHz
531953
MediaTek Dimensity 1000 Plus
MediaTek Dimensity 1000 Plus 8C @ 2600 MHz
523574
MediaTek Dimensity 7030
MediaTek Dimensity 7030 8C @ 2500 MHz
522736
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
516049
HiSilicon Kirin 820
HiSilicon Kirin 820 8C @ 2360 MHz
498005
MediaTek Dimensity 7025
MediaTek Dimensity 7025 8C @ 2500 MHz
495066
Unisoc T820
Unisoc T820 8C @ 2700 MHz
492038
Geekbench 6 单核
Qualcomm Snapdragon 4 Gen 2
Qualcomm Snapdragon 4 Gen 2 8C @ 2200 MHz
926
MediaTek Dimensity 930
MediaTek Dimensity 930 8C @ 2200 MHz
922
Qualcomm Snapdragon 695
Qualcomm Snapdragon 695 8C @ 2200 MHz
916
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
898
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
884
Qualcomm Snapdragon 750G
Qualcomm Snapdragon 750G 8C @ 2200 MHz
881
Apple A10 Fusion
Apple A10 Fusion 4C @ 2340 MHz
879
Geekbench 6 多核
Unisoc T820
Unisoc T820 8C @ 2700 MHz
2301
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
2291
MediaTek Dimensity 800
MediaTek Dimensity 800 8C @ 2000 MHz
2276
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
2240
Apple A10X Fusion
Apple A10X Fusion 6C @ 2380 MHz
2201
Qualcomm Snapdragon 695
Qualcomm Snapdragon 695 8C @ 2200 MHz
2145
MediaTek Dimensity 6300
MediaTek Dimensity 6300 8C @ 2400 MHz
2135
FP32浮点性能
Samsung Exynos 9825
Samsung Exynos 9825 8C @ 2730 MHz
651
Apple A13 Bionic
Apple A13 Bionic 6C @ 2650 MHz
629
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
621
Samsung Exynos 1380
Samsung Exynos 1380 8C @ 2400 MHz
608
Samsung Exynos 9820
Samsung Exynos 9820 8C @ 2730 MHz
607
Apple A12 Bionic
Apple A12 Bionic 6C @ 2490 MHz
576
Qualcomm Snapdragon 765
Qualcomm Snapdragon 765 8C @ 2300 MHz
576

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MediaTek Dimensity 900 vs Unisoc T820
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MediaTek Dimensity 900 vs Qualcomm Snapdragon 7s Gen 2
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MediaTek Dimensity 8300 vs MediaTek Dimensity 900
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MediaTek Dimensity 900 vs HiSilicon Kirin 9000E
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MediaTek Dimensity 900 vs Qualcomm Snapdragon 810
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MediaTek Dimensity 900 vs Qualcomm Snapdragon 439
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