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MediaTek Dimensity 7020

MediaTek Dimensity 7020
这是一款采用了台积电 6nm工艺的处理器，上市时间为2023年5月1日。采用了8核心设计，频率为2200MHz，TDP为0W，集成了IMG BXM-8-256核显。

处理器

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架构
2x 2.2 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
主频
2200 MHz
核心数
8
指令集
ARMv8.2-A
制程
6 nm
制造厂
TSMC

显卡

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显卡型号
IMG BXM-8-256
主频
900 MHz
执行单元
8
着色单元
18
FLOPS
0.2592 TFLOPS
Vulkan 版本
1.3
OpenCL 版本
3.0
FLOPS
259.2 GFLOPS

内存

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内存类型
LPDDR5
内存频率
3200 MHz
总线
4x 16 Bit

多媒体

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神经网络处理器 (NPU)
Yes
存储类型
UFS 2.2, UFS 3.1
最大显示分辨率
2520 x 1080
最大相机分辨率
1x 108MP
视频拍摄
2K at 30FPS
视频播放
2K at 30FPS
视频编码
H.264, H.265, VP9
音频编码
AAC, AIFF, CAF, MP3, MP4, WAV

网络

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4G网络
LTE Cat. 18
5G网络
Yes
下载速度
Up to 2770 Mbps
上传速度
Up to 1250 Mbps
Wi-Fi
5
蓝牙
5.2
导航定位
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

其他信息

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发行日期
2023年5月
级别
Mid range
官网链接
MediaTek Dimensity 7020

排行榜

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安兔兔 10
MediaTek Dimensity 820
MediaTek Dimensity 820 8C @ 2600 MHz
489218
Samsung Exynos 1280
Samsung Exynos 1280 8C @ 2400 MHz
481288
Qualcomm Snapdragon 768G
Qualcomm Snapdragon 768G 8C @ 2800 MHz
480375
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
476443
Samsung Exynos 9810
Samsung Exynos 9810 8C @ 2900 MHz
472858
MediaTek Dimensity 930
MediaTek Dimensity 930 8C @ 2200 MHz
462135
HiSilicon Kirin 810
HiSilicon Kirin 810 8C @ 2270 MHz
457024
Geekbench 6 单核
MediaTek Dimensity 930
MediaTek Dimensity 930 8C @ 2200 MHz
924
Qualcomm Snapdragon 695
Qualcomm Snapdragon 695 8C @ 2200 MHz
916
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
898
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
888
Qualcomm Snapdragon 750G
Qualcomm Snapdragon 750G 8C @ 2200 MHz
881
Apple A10 Fusion
Apple A10 Fusion 4C @ 2340 MHz
879
Samsung Exynos 1330
Samsung Exynos 1330 8C @ 2400 MHz
879
Geekbench 6 多核
MediaTek Dimensity 920
MediaTek Dimensity 920 8C @ 2500 MHz
2331
MediaTek Dimensity 930
MediaTek Dimensity 930 8C @ 2200 MHz
2328
Unisoc T820
Unisoc T820 8C @ 2700 MHz
2301
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
2297
MediaTek Dimensity 800
MediaTek Dimensity 800 8C @ 2000 MHz
2276
MediaTek Dimensity 900
MediaTek Dimensity 900 8C @ 2400 MHz
2240
Apple A10X Fusion
Apple A10X Fusion 6C @ 2380 MHz
2201
FP32浮点性能
MediaTek Helio G99
MediaTek Helio G99 8C @ 2200 MHz
281
HiSilicon Kirin 960
HiSilicon Kirin 960 8C @ 2360 MHz
265
Samsung Exynos 980
Samsung Exynos 980 8C @ 2200 MHz
262
MediaTek Helio G95
MediaTek Helio G95 8C @ 2050 MHz
259
Samsung Exynos 880
Samsung Exynos 880 8C @ 2000 MHz
259
MediaTek Dimensity 930
MediaTek Dimensity 930 8C @ 2200 MHz
259
MediaTek Dimensity 7020
MediaTek Dimensity 7020 8C @ 2200 MHz
259

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MediaTek Dimensity 7020 vs Samsung Exynos 1330
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Qualcomm Snapdragon 710 vs MediaTek Dimensity 7020
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MediaTek Dimensity 7020 vs Qualcomm Snapdragon 695
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MediaTek Dimensity 7020 vs Qualcomm Snapdragon 870
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MediaTek Dimensity 7020 vs Qualcomm Snapdragon 730
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MediaTek Dimensity 7020 vs Qualcomm Snapdragon 782G
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