Qualcomm Snapdragon 888 Plus vs MediaTek Helio G36

VS

Qualcomm Snapdragon 888 Plus MediaTek Helio G36

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2200MHz MediaTek Helio G36. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.0435 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 13.9GB/s)

Tinggi Frekuensi (2995MHz vs 2200MHz)

Proses pembuatan yang lebih moden (5nm vs 12nm)

MediaTek Helio G36 Kelebihan

Penggunaan kuasa lebih rendah (2.2W berbanding 8W)

Dikeluarkan lewat 8 bulan

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +441%

836957

MediaTek Helio G36

154460

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +437%

1230

MediaTek Helio G36

229

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +345%

3778

MediaTek Helio G36

848

FP32 (float)

Qualcomm Snapdragon 888 Plus +4209%

1853

MediaTek Helio G36

43

Qualcomm Snapdragon 888 Plus

VS

MediaTek Helio G36

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

4x 2.2 GHz – Cortex-A53
4x 1.8 GHz – Cortex-A53

2995 MHz

Frekuensi

2200 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

-

5 nm

Proses

12 nm

10.3

Bilangan transistor

-

8 W

TDP

2.2 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

PowerVR GE8320

905 MHz

Frekuensi GPU

680 MHz

2

Unit pelaksanaan

4

512

Unit pewarnaan

8

24

Saiz maks

8

1.8534 TFLOPS

FLOPS

0.0435 TFLOPS

1.1

Versi Vulkan

1.1

2.0

Versi OpenCL

1.2

12.1

Versi DirectX

-

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1600 MHz

4x 16 Bit

Bas

2x 16 Bit

51.2 Gbit/s

Lebar jalur maks

13.9 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

No

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

No

UFS 3.0, UFS 3.1

Jenis storan

eMMC 5.1

3840 x 2160

Resolusi paparan maks

2400 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 50MP, 2x 13MP

8K at 30FPS, 4K at 120FPS

Rakaman video

1K at 30FPS

8K at 30FPS

Main balik video

1080p at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 7

Yes

Sokongan 5G

No

Up to 7500 Mbps

Kelajuan muat turun

Up to 300 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 150 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.0

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Jun 2021

Diumumkan

Feb 2022

Flagship

Kelas

Low end

SM8350-AC

Nombor model

-

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Helio G36

Perbandingan SoC Berkaitan

1

Qualcomm Snapdragon 7 Plus Gen 3 vs Qualcomm Snapdragon 888 Plus

2

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

4

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

5

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 888 Plus

6

Qualcomm Snapdragon 8 Gen 3 vs Qualcomm Snapdragon 888 Plus

7

Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 888 Plus

8

Unisoc T606 vs MediaTek Helio G36

9

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 6080

10

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 835