Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 810

VS

Qualcomm Snapdragon 888 Plus MediaTek Dimensity 810

Kami membandingkan dua versi SoC telefon: 8 teras 2995MHz Qualcomm Snapdragon 888 Plus vs. 8 teras 2400MHz MediaTek Dimensity 810. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 888 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (1.8534 TFLOPS vs 0.243 TFLOPS )

Lebar jalur memori yang lebih besar (51.2GB/s vs 17.07GB/s)

Tinggi Frekuensi (2995MHz vs 2400MHz)

Proses pembuatan yang lebih moden (5nm vs 6nm)

MediaTek Dimensity 810 Kelebihan

Penggunaan kuasa lebih rendah (6W berbanding 8W)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 888 Plus +93%

836957

MediaTek Dimensity 810

433200

Geekbench 6 Single Core

Qualcomm Snapdragon 888 Plus +56%

1230

MediaTek Dimensity 810

787

Geekbench 6 Multi Core

Qualcomm Snapdragon 888 Plus +94%

3778

MediaTek Dimensity 810

1945

FP32 (float)

Qualcomm Snapdragon 888 Plus +662%

1853

MediaTek Dimensity 810

243

Qualcomm Snapdragon 888 Plus

VS

MediaTek Dimensity 810

CPU

1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)

Seni bina

2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55

2995 MHz

Frekuensi

2400 MHz

8

Teras

8

1 MB

Cache L2

1 MB

0

Cache L3

0

5 nm

Proses

6 nm

10.3

Bilangan transistor

12

8 W

TDP

6 W

Samsung

Pembuatan

TSMC

Grafik

Adreno 660

Nama GPU

Mali-G57 MP2

905 MHz

Frekuensi GPU

950 MHz

2

Unit pelaksanaan

2

512

Unit pewarnaan

64

24

Saiz maks

16

1.8534 TFLOPS

FLOPS

0.243 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

2133 MHz

4x 16 Bit

Bas

2x 16 Bit

51.2 Gbit/s

Lebar jalur maks

17.07 Gbit/s

AI

Hexagon 780

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 780

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 3.0, UFS 3.1

Jenis storan

UFS 2.2

3840 x 2160

Resolusi paparan maks

2520 x 1080

1x 200MP, 2x 25MP

Resolusi kamera maks

1x 64MP, 2x 16MP

8K at 30FPS, 4K at 120FPS

Rakaman video

2K at 30FPS

8K at 30FPS

Main balik video

2K at 30FPS

H.264, H.265, VP8, VP9

Codec video

H.264, H.265, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC

X60

Modem

-

Kesambungan

LTE Cat. 22

Sokongan 4G

LTE Cat. 18

Yes

Sokongan 5G

Yes

Up to 7500 Mbps

Kelajuan muat turun

Up to 2770 Mbps

Up to 3000 Mbps

Kelajuan muat naik

Up to 1250 Mbps

6

Wi-Fi

5

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Jun 2021

Diumumkan

Ogo 2021

Flagship

Kelas

Mid range

SM8350-AC

Nombor model

MT6833V

Qualcomm Snapdragon 888 Plus

Halaman rasmi

MediaTek Dimensity 810

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2

Qualcomm Snapdragon 8s Gen 3 vs Qualcomm Snapdragon 888 Plus

3

Qualcomm Snapdragon 888 Plus vs Qualcomm Snapdragon 7 Gen 3

4

Samsung Exynos 1480 vs Qualcomm Snapdragon 888 Plus

5

Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8300

6

Qualcomm Snapdragon 8 Gen 3 vs Qualcomm Snapdragon 888 Plus

7

Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 888 Plus

8

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9

Qualcomm Snapdragon 888 Plus vs Apple A9

10

Qualcomm Snapdragon 888 Plus vs Unisoc T820