Qualcomm Snapdragon 782G vs MediaTek Dimensity 1000 Plus

VS

Qualcomm Snapdragon 782G MediaTek Dimensity 1000 Plus

Kami membandingkan dua versi SoC telefon: 8 teras 2700MHz Qualcomm Snapdragon 782G vs. 8 teras 2600MHz MediaTek Dimensity 1000 Plus. Anda akan mengetahui pemproses mana yang berprestasi lebih baik dalam ujian penanda aras, spesifikasi utama, penggunaan kuasa, dan banyak lagi.

Perbezaan Utama

Qualcomm Snapdragon 782G Kelebihan

Tinggi Frekuensi (2700MHz vs 2600MHz)

Proses pembuatan yang lebih moden (6nm vs 7nm)

Penggunaan kuasa lebih rendah (5W berbanding 10W)

Dikeluarkan lewat 2 tahun dan 6 bulan

MediaTek Dimensity 1000 Plus Kelebihan

Prestasi kad grafik yang lebih baik FLOPS (0.9792 TFLOPS vs 0.7526 TFLOPS )

Lebar jalur memori yang lebih besar (29.87GB/s vs 25.6GB/s)

Skor

Penanda Aras

AnTuTu 10

Qualcomm Snapdragon 782G +24%

649399

MediaTek Dimensity 1000 Plus

523574

Geekbench 6 Single Core

Qualcomm Snapdragon 782G +8%

1127

MediaTek Dimensity 1000 Plus

1040

Geekbench 6 Multi Core

Qualcomm Snapdragon 782G

2839

MediaTek Dimensity 1000 Plus +11%

3152

FP32 (float)

Qualcomm Snapdragon 782G

752

MediaTek Dimensity 1000 Plus +30%

979

Qualcomm Snapdragon 782G

VS

MediaTek Dimensity 1000 Plus

CPU

1x 2.7 GHz – Cortex-A78
3x 2.4 GHz – Cortex-A78
4x 1.9 GHz – Cortex-A55

Seni bina

4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55

2700 MHz

Frekuensi

2600 MHz

8

Teras

8

1 MB

Cache L2

-

0

Cache L3

0

6 nm

Proses

7 nm

5 W

TDP

10 W

TSMC

Pembuatan

TSMC

Grafik

Adreno 642

Nama GPU

Mali-G77 MP9

490 MHz

Frekuensi GPU

850 MHz

2

Unit pelaksanaan

9

384

Unit pewarnaan

64

16

Saiz maks

16

0.7526 TFLOPS

FLOPS

0.9792 TFLOPS

1.1

Versi Vulkan

1.3

2.0

Versi OpenCL

2.0

12.1

Versi DirectX

12

Memori

LPDDR5

Jenis memori

LPDDR4X

3200 MHz

Frekuensi memori

1866 MHz

2x 16 Bit

Bas

4x 16 Bit

25.6 Gbit/s

Lebar jalur maks

29.87 Gbit/s

AI

Hexagon 770

Pemproses neural (NPU)

MediaTek APU 3.0

Multimedia (ISP)

Hexagon 770

Pemproses neural (NPU)

MediaTek APU 3.0

UFS 2.2, UFS 3.0, UFS 3.1

Jenis storan

UFS 2.2

2520 x 1080

Resolusi paparan maks

2520 x 1080

1x 200MP

Resolusi kamera maks

1x 80MP, 2x 32MP

4K at 30FPS

Rakaman video

4K at 30FPS

Main balik video

4K at 30FPS

H.264, H.265, VP9

Codec video

H.264, H.265, AV1, VP9

AAC, AIFF, CAF, MP3, MP4, WAV

Codec audio

AIFF, CAF, MP3, MP4, WAV

X53

Modem

Helio M70

Kesambungan

LTE Cat. 24

Sokongan 4G

LTE Cat. 19

Yes

Sokongan 5G

Yes

Up to 3700 Mbps

Kelajuan muat turun

Up to 4700 Mbps

Up to 1600 Mbps

Kelajuan muat naik

Up to 2500 Mbps

6

Wi-Fi

6

5.2

Bluetooth

5.1

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigasi

GPS, GLONASS, Beidou, Galileo, QZSS

Info

Nov 2022

Diumumkan

Mei 2020

Mid range

Kelas

Flagship

SM7325-AF

Nombor model

MT6889Z/CZA

Qualcomm Snapdragon 782G

Halaman rasmi

MediaTek Dimensity 1000 Plus

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