Home GPU Comparison AMD Ryzen 7 5700X3D vs Intel Core Ultra 9 285K

AMD Ryzen 7 5700X3D vs Intel Core Ultra 9 285K

We compared two desktop CPUs: AMD Ryzen 7 5700X3D with 8 cores 3.0GHz and Intel Core Ultra 9 285K with 24 cores 3.7GHz . You will find out which processor performs better in benchmark tests, key specifications, power consumption and more.

Main Differences

AMD Ryzen 7 5700X3D 's Advantages
Larger L3 cache size (96MB vs 36MB)
Lower TDP (105W vs 125W)
Intel Core Ultra 9 285K 's Advantages
Released 9 months late
Integrated graphics card
Higher specification of memory (6400 vs 3200)
Larger memory bandwidth (102.4GB/s vs 51.2GB/s)
Newer PCIe version (5.0 vs 4.0)
Higher base frequency (3.7GHz vs 3.0GHz)
More modern manufacturing process (3nm vs 7nm)

Score

Benchmark

Cinebench R23 Single Core
AMD Ryzen 7 5700X3D
1356
Intel Core Ultra 9 285K +70%
2318
Cinebench R23 Multi Core
AMD Ryzen 7 5700X3D
13524
Intel Core Ultra 9 285K +207%
41583
Geekbench 6 Single Core
AMD Ryzen 7 5700X3D
1941
Intel Core Ultra 9 285K +74%
3380
Geekbench 6 Multi Core
AMD Ryzen 7 5700X3D
10101
Intel Core Ultra 9 285K +128%
23087
Cinebench 2024 Single Core
AMD Ryzen 7 5700X3D
84
Intel Core Ultra 9 285K +69%
142
Cinebench 2024 Multi Core
AMD Ryzen 7 5700X3D
806
Intel Core Ultra 9 285K +192%
2357
Blender
AMD Ryzen 7 5700X3D
234
Intel Core Ultra 9 285K +180%
656
Passmark CPU Single Core
AMD Ryzen 7 5700X3D
2971
Intel Core Ultra 9 285K +70%
5080
Passmark CPU Multi Core
AMD Ryzen 7 5700X3D
26329
Intel Core Ultra 9 285K +157%
67744

General Parameters

Jan 2024
Release Date
Oct 2024
Amd
Manufacturer
Intel
Desktop
Type
Desktop
x86-64
Instruction Set
x86-64
Zen 3 (Vermeer)
Core Architecture
Arrow Lake
-
Processor Number
285K
AM4
Socket
FCLGA-1851
No
Integrated Graphics
Arc iGPU (4-Cores)
Ryzen 7 (Zen 3 (Vermeer))
Generation
Ultra 9(Arrow Lake)

Package

8.85 billions
Transistor Count
-
7 nm
Manufacturing Process
3 nm
-
-
-
105 W
Power Consumption
125 W
142 W
Max Turbo Power Consumption
250 W
90 °C
Peak Operating Temperature
105 °C
TSMC
Foundry
TSMC
74 mm²
Die Size
-
12 nm
I/O Process Size
-
125 mm²
I/O Die Size
-
-
-
-

CPU Performance

8
Performance Cores
8
16
Performance Core Threads
8
3.0 GHz
Performance Core Base Frequency
3.7 GHz
4.1 GHz
Performance Core Turbo Frequency
5.5 GHz
-
Efficiency Cores
16
-
Efficiency Core Threads
16
-
Efficiency Core Base Frequency
3.2 GHz
-
Efficiency Core Turbo Frequency
4.6 GHz
8
Total Core Count
24
16
Total Thread Count
24
100 MHz
Bus Frequency
100 MHz
30
Multiplier
37
-
-
-
64 K per core
L1 Cache
112 K per core
512 K per core
L2 Cache
3 MB per core
96 MB shared
L3 Cache
36 MB shared
No
Unlocked Multiplier
Yes
-
-
-
-
1
SMP
1
-
-
-
-
-
-

Memory Parameters

DDR4-3200
Memory Types
DDR5-6400
128 GB
Max Memory Size
192 GB
2
Max Memory Channels
2
51.2 GB/s
Max Memory Bandwidth
102.4 GB/s
Yes
ECC Memory Support
Yes

Graphics Card Parameters

-
Integrated Graphics
true
-
GPU Base Frequency
300 MHz
-
GPU Max Dynamic Frequency
2000 MHz
-
Shader Units
512
-
Texture Units
32
-
Raster Operation Units
16
-
Execution Units
64
-
Power Consumption
14
-
-
-
-
Graphics Performance
2 TFLOPS

AI Accelerator

-
-
-
-
-
-

Miscellaneous

4.0
PCIe Version
5.0
20
PCIe Lanes
24
-
-
-
-
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