MediaTek Dimensity 7020 vs HiSilicon Kirin 970

VS

MediaTek Dimensity 7020 HiSilicon Kirin 970

We compared two versions of phone SoCs: 8 cores 2200MHz MediaTek Dimensity 7020 vs. 8 cores 2360MHz HiSilicon Kirin 970 . You will find out which processor performs better in benchmark tests, key specifications, power consumption, and more.

Main Differences

MediaTek Dimensity 7020 Advantages

Larger memory bandwidth (51.2GB/s vs 29.8GB/s)

More modern manufacturing process (6nm vs 10nm)

Lower TDP (4W vs 9W)

Released 5 years and 8 months late

HiSilicon Kirin 970 Advantages

Better graphics card performance FLOPS (0.3318 TFLOPS vs 0.2592 TFLOPS )

Higher Frequency (2360MHz vs 2200MHz)

Score

Benchmark

AnTuTu 10

MediaTek Dimensity 7020 +32%

471522

HiSilicon Kirin 970

355946

FP32 (float)

MediaTek Dimensity 7020

259

HiSilicon Kirin 970 +27%

331

MediaTek Dimensity 7020

VS

HiSilicon Kirin 970

CPU

2x 2.2 GHz – Cortex-A78
6x 2 GHz – Cortex-A55

Architecture

4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53

2200 MHz

Frequency

2360 MHz

8

Cores

8

-

L2 cache

2 MB

-

L3 cache

0

6 nm

Process

10 nm

10

Transistor count

5.5

4 W

TDP

9 W

TSMC

Manufacturing

TSMC

Graphics

IMG BXM-8-256

GPU name

Mali-G72 MP12

900 MHz

GPU frequency

768 MHz

8

Execution units

12

18

Shading units

18

16

Max size

8

0.2592 TFLOPS

FLOPS

0.3318 TFLOPS

1.3

Vulkan version

1.3

3.0

OpenCL version

2.0

-

DirectX version

12

Memory

LPDDR5

Memory type

LPDDR4X

3200 MHz

Memory frequency

1866 MHz

4x 16 Bit

Bus

4x 16 Bit

51.2 Gbit/s

Max bandwidth

29.8 Gbit/s

AI

Yes

NPU

Yes

Multimedia (ISP)

Yes

Neural processor (NPU)

Yes

UFS 2.2, UFS 3.1

Storage type

UFS 2.1

2520 x 1080

Max display resolution

3120 x 1440

1x 108MP

Max camera resolution

1x 48MP, 2x 20MP

2K at 30FPS

Video capture

4K at 30FPS

2K at 30FPS

Video playback

4K at 30FPS

H.264, H.265, VP9

Video codecs

H.264, H.265, VP8, VP9, VC-1

AAC, AIFF, CAF, MP3, MP4, WAV

Audio codecs

32 bit@384 kHz, HD-audio

Connectivity

LTE Cat. 18

4G support

LTE Cat. 18

Yes

5G support

No

Up to 2770 Mbps

Download speed

Up to 1200 Mbps

Up to 1250 Mbps

Upload speed

Up to 150 Mbps

5

Wi-Fi

5

5.2

Bluetooth

4.2

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Navigation

GPS, GLONASS, Beidou, Galileo

Info

May 2023

Announced

Sep 2017

Mid range

Class

Flagship

-

Model number

Hi3670

MediaTek Dimensity 7020

Official page

HiSilicon Kirin 970

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