Home Qualcomm Snapdragon 821

Qualcomm Snapdragon 821

Qualcomm Snapdragon 821
This is a processor manufactured using the Samsung 14nm process, announced on August 1, 2016. It features 4 cores, operates at a frequency of 2342MHz, has a TDP of 11W, and integrates the Adreno 530 GPU.

CPU

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Architecture
2x 2.342 GHz – Kryo
2x 1.6 GHz – Kryo
Frequency
2342 MHz
Cores
4
Instruction set
ARMv8-A
L1 cache
L2 cache
1 MB
Process
14 nm
Transistor count
2
TDP
11 W
Manufacturing
Samsung

Graphics

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GPU name
Adreno 530
GPU frequency
653 MHz
Execution units
1
Shading units
256
FLOPS
0.3343 TFLOPS
Vulkan version
1.0
OpenCL version
2.0
DirectX version
11
FLOPS
334.3 GFLOPS

Memory

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Memory type
LPDDR4
Memory frequency
1866 MHz
Bus
4x 16 Bit
Max bandwidth
29.8 Gbit/s

Multimedia (ISP)

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Neural processor (NPU)
Hexagon 680
Storage type
eMMC 5.1, UFS 2.0
Max display resolution
3840 x 2160
Max camera resolution
1x 28MP, 2x 13MP
Video capture
4K at 30FPS
Video playback
4K at 30FPS
Video codecs
H.264, H.265, VP8, VP9
Audio codecs
AIFF, CAF, MP3, MP4, WAV

Connectivity

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4G support
LTE Cat. 12
5G support
No
Download speed
Up to 600 Mbps
Upload speed
Up to 150 Mbps
Wi-Fi
5
Bluetooth
4.1
Navigation
GPS, GLONASS, Beidou, Galileo

Info

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Announced
Aug 2016
Class
Flagship
Model number
MSM8996 Pro-AC
Official page

Rankings

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AnTuTu 10
Qualcomm Snapdragon 665
235607
HiSilicon Kirin 710A
HiSilicon Kirin 710A 8C @ 2000 MHz
234102
Mediatek Helio P60
Mediatek Helio P60 8C @ 2000 MHz
233519
Qualcomm Snapdragon 821
233076
Samsung Exynos 8890
Samsung Exynos 8890 8C @ 2300 MHz
228887
MediaTek Helio P65
MediaTek Helio P65 8C @ 2000 MHz
227668
Qualcomm Snapdragon 660
225927
Geekbench 6 Single Core
HiSilicon Kirin 960
HiSilicon Kirin 960 8C @ 2360 MHz
408
Qualcomm Snapdragon 821
391
HiSilicon Kirin 970
HiSilicon Kirin 970 8C @ 2360 MHz
386
Qualcomm Snapdragon 670
384
MediaTek Helio P65
MediaTek Helio P65 8C @ 2000 MHz
377
Geekbench 6 Multi Core
Qualcomm Snapdragon 439
799
MediaTek Helio P20
MediaTek Helio P20 8C @ 2300 MHz
798
Qualcomm Snapdragon 821
797
Qualcomm Snapdragon 450
763
Qualcomm Snapdragon 650
750
FP32 (float)
Qualcomm Snapdragon 4 Gen 2
366
Qualcomm Snapdragon 670
358
Qualcomm Snapdragon 730
358
Qualcomm Snapdragon 821
334
MediaTek Dimensity 800
332
HiSilicon Kirin 970
HiSilicon Kirin 970 8C @ 2360 MHz
331
MediaTek Dimensity 720
326

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