Some time ago, rumors surfaced about a retired former senior executive of TSMC potentially moving to Intel. Given its implications concerning advanced processes and internal technical methodologies, TSMC initiated a legal investigation to ascertain if there has been any leakage of trade secrets.

Several foreign media outlets have identified this executive as Dr. Wei-Jen Luo, who has significantly contributed to TSMC's developments in advanced processes, particularly at crucial nodes like 2nm and 1.6nm. With 21 years at TSMC, Dr. Luo stands out as one of the few senior executives deeply embedded in the company's advanced process roadmap. At about 75 years old, he holds a degree in Physics from National Taiwan University and a Ph.D. in Solid State Physics and Surface Chemistry from the University of California, Berkeley, marking his early entry into the semiconductor manufacturing industry from an academic background. Before joining TSMC, he served as Intel’s CTM Plant Manager and Advanced Technology Development Associate, amassing extensive knowledge in wafer manufacturing processes and equipment introduction. His tenure at TSMC covered advanced process research and development, corporate strategic planning, and cross-functional organization, positioning him as a pivotal internal technology leader.

Within TSMC, he was privy to high-level information closely tied to the advancement of various process routes. It is understood that the meetings he participated in during his tenure were characterized by high confidentiality, and he had a habit of recording technical discussions in handwritten notes. These notes, taken along when he departed, thus became central to the investigation.

Should Dr. Luo eventually join Intel, it could profoundly influence Intel's foundry program. Having served at TSMC for nearly two decades, his background includes the implementation of EUV lithography, the establishment of advanced process risk controls, and streamlining organizational structures. Reports from Taiwanese media cite his role in forming TSMC’s "Nighthawk Team", renowned for its rapid problem-solving and cross-departmental collaboration, which is seen as a crucial component of TSMC's seamless advancement in manufacturing. Speculation abounds that if he joins Intel, he may introduce similar management styles and R&D methodologies.

In recent years, Intel has been advancing its IDM 2.0 strategy, expanding fab capacities within the U.S. and Europe, with aims to foster competitiveness in the 18A and 14A process nodes. Acquiring talent well-versed in advanced process nodes indeed has the potential to bolster its R&D team.

For TSMC, the investigation doesn’t pre-assume any law violations but rather focuses on verifying the control of sensitive information and determining if additional protective measures are necessary. From Intel’s perspective, leveraging experience from a globally leading manufacturing company could bolster its foundry business strategies for the years ahead. As competition intensifies between the two technology giants in advanced processes, the movement of high-level management naturally garners significant industry attention.

Currently, all processes remain in the evaluative and communicative stage without any official confirmation. Regardless of the investigation's outcome, this situation reiterates the sensitivity of advanced process research and development. As semiconductor competition continues to escalate, this type of cross-business mobility is expected to face heightened scrutiny, compelling the industry to operate under stricter technical compliance measures.