According to market sources, Longchamp has launched its development of the next-generation 3D7000 series CPUs, set to feature more than 32 cores and employ a refined 10nm process technology. Aimed for release in 2027, this series promises a substantial leap in core numbers, interface capabilities, and foundational IP architecture compared to current offerings.

Currently, Dragoncore's server processors include the 3C6000 and 3D5000 models. The 3C6000 uses a 12nm process with a single 16-core chip, expandable to 64 cores with a four-chip package, featuring a TDP of up to 300W, designed for server applications. Meanwhile, the 3D5000 targets workstation markets with a 32-core configuration operating at 2.0GHz. In contrast, the upcoming 3D7000 aims to integrate over 32 cores per chip, effectively doubling core density. This indicates a novel architecture and design evolution is underway.

Longchip has initiated the foundational IP designs for the "Xnm" process node, integrating critical components like phase-locked loops (PLLs), multi-port register files, DDR5-PHYs, and PCIe 5.0 PHYs, among others. The 3D7000 series will fully support DDR5 and PCIe 5.0, crucial for server platforms, aligning with international server CPU standards. Utilizing a sub-10nm process, the series is expected to offer enhanced frequency potential, reduced power density, and increased packaging space, allowing for higher core count and bandwidth.

The development timeline for the 3D7000 aligns with the typical pace for new-generation international products. For instance, AMD's next-gen Zen 6 server architecture, featuring 12-core and 32-core high-density CCDs, is expected to hit the market between 2026 and 2027. If Longchip adheres to its 2027 release schedule for the 3D7000, its practical deployment could begin around 2028, coinciding with domestic data centers' growing demand for localized solutions.

In addition to its server product line, Longchamp has unveiled the 9A1000, a discrete graphics card for AI PCs, expected to launch next year. The chip has already completed its production flow, and driver support for Windows systems is underway. The introduction of this graphics card showcases Longchip's commitment to enhancing the graphics acceleration segment of its comprehensive ecosystem, providing a robust hardware and software chain for domestic OEMs and government enterprise markets.

As reliance on autonomous systems in the domestic market intensifies, the path toward localizing server CPUs and entry-level GPUs becomes clearer. Though final specifications for the 3D7000 series, such as micro-architecture details, SKU layout, and frequency, remain undisclosed, current insights suggest advancements in core density, interface bandwidth, and manufacturing processes. For Longchip, this marks a pivotal step in evolving its server platform offerings.