Recently, Intel confirmed that its glass substrate program is progressing according to its established roadmap and dismissed external rumors suggesting that commercialization efforts have been halted or the technology abandoned. The company emphasized that the project remains on course without any deviation and no licensing agreement has been reached with Samsung Electronics. Intel's current objective is to continue independently advancing the related research and development along with future implementation.

Glass substrates represent an advanced packaging material under exploration to replace traditional organic substrates. Compared to organic materials, glass substrates offer distinct advantages: their higher mechanical strength enhances chip package durability and reliability, while their thinner profiles and greater flatness foster dense interconnections, accommodating higher bandwidth and more complex packaging structures. Given that advanced packaging technology is increasingly vital for boosting computing performance, glass substrates are seen as a critical future direction.

Concerns had previously been raised about the potential slowing progress of Intel's project. Reports suggested that some core personnel might have left for Samsung Electronics' mechanical department, fueling speculation of Intel reducing or even ceasing its research and development efforts. However, Intel's latest statement affirms that its glass substrate roadmap remains aligned with the plan announced in 2023 with no adjustments. Although there were beliefs that Intel might license the technology to Samsung to cut down on plant construction costs, the company has no such plans.

Other major industry players are actively exploring similar pathways. With its expertise in display technology and glass processing, Samsung is poised to catch up on the manufacturing front, having recently launched a team to explore experimental projects. Although TSMC has not publicized any large-scale glass substrate plans, it is widely believed that the company is conducting parallel research into evolving CoWoS and SoIC advanced packaging. Additionally, Japanese companies Asahi Glass, Shin-Etsu Chemical, and South Korea's SKC have declared entry into this field, and the complete industry chain is gradually taking shape.

For the semiconductor industry, the significance of glass substrates lies in their potential to provide a new avenue for sustaining Moore's Law. As transistor advancements slow, the trend is towards improving overall performance through chiplet and multi-chip packaging, demanding more substantial substrates with enhanced interconnect capabilities. Glass substrates meet these criteria and are widely regarded as a crucial material in the “post-organic substrate era." Although large-scale commercialization still faces challenges in cost and yield, in the long term, they could become the essential foundation for high-performance computing and AI chips.

From a market perspective, Intel's statement helps to stabilize external expectations while showcasing its plans for medium- to long-term competition. As AI and high-performance computing demands continue to rise, advanced packaging solutions grow increasingly important. Intel’s commitment to glass substrates indicates this technology will play a role in its future competitive strategy.