Source @7931doomer111 has shared a tweet revealing details of AMD's 'Strix Halo' Zen 5 APU, highlighting that the graphics die equipped with RDNA 3.5 technology measures 307 square millimeters.

The exposed information indicates that AMD's 'Strix Halo' Zen 5 APU comes in an FP11 package, with the overall package dimensions being 37.5 x 45 mm, aligning with the LGA-1700 socket panel.

The infographic reveals that the largest die is a graphics module employing RDNA 3.5 technology with an area of at least 307 square millimeters. The smaller die consists of two CCDs (each providing 8 Zen5 cores) measuring 66.3 square millimeters.

Another image exposed thermal design data for AMD's 'Strix Halo' Zen 5 APU. The data includes 55W, 85W, and 120W options (excluding memory power consumption). AMD estimates memory power consumption to be 9W for a 32GB system and 13W for a 128GB system.