Berita Industri
Former Intel CEO Pat Claims Quantum Computing Could Replace GPUs within Two Years
Pat Gelsinger shares insights on AI, quantum computing, and Intel's management challenges, offering ...
Ahad, 30 November 2025
Intel to Equip Next-Gen Chips with 144MB Cache to Rival AMD's 3D V-Cache
Intel's Nova Lake processors to strategically utilize large-capacity bLLC to compete with AMD's Ryze...
Rabu, 26 November 2025
Recent European Sales Data Indicates AMD Outselling Intel by Tenfold
AMD significantly outpaces Intel in CPU sales at German retailer Mindfactory, driven by strong deman...
Selasa, 25 November 2025
Intel Goes All-In on 14A, Plans to Launch RTX Graphics for NVIDIA
Intel's 14A process development is progressing, with early collaboration with external customers. Th...
Isnin, 24 November 2025
Intel Reportedly Secures Major Clients Like Microsoft, Tesla, Qualcomm, and NVIDIA
With the U.S. accelerating its domestic semiconductor supply chain, Intel emerges as a key player, b...
Sabtu, 22 November 2025
Intel Confirms 18A Launch Date, Yield Continues to Improve
Intel's Panther Lake processors, debuting in January 2026, offer advanced features, including the 18...
Jumaat, 21 November 2025
TSMC Executive Joins Intel Amid Rumors of Taking 2nm Process Notes
Former TSMC executive Dr. Wei-Jen Luo's potential move to Intel raises concerns over trade secrets a...
Rabu, 19 November 2025
Loongson Set to Launch 32-Core Processor with 10nm Process Technology by 2027
Longchamp is developing the 3D7000 series CPUs with over 32 cores and a 10nm process, targeting a 20...
Selasa, 18 November 2025
Major Corporations Begin Exploring Intel's Advanced Packaging Solutions
Intel's EMIB and Foveros technologies are gaining traction among tech giants.
Isnin, 17 November 2025
Valve Unveils Groundbreaking New Product to Challenge PlayStation Ecosystem
The new Steam Machine from Valve merges the PC and console gaming worlds, offering a compact console...
Khamis, 13 November 2025
Intel Unveils New Technology, Poised for Extensive Use in Future Advanced Packaging
Intel unveils a pioneering decoupled design method for heat sinks to enhance chip manufacturing and ...
Selasa, 11 November 2025
AMD Responds to Intel-NVIDIA Partnership: Intensified Competition and Pricing Pressures Ahead
Explore AMD's response to the Intel-NVIDIA partnership and its implications for the chip industry's ...
Jumaat, 7 November 2025
AMD's New High-End Product Appears on Passmark
AMD is set to release two new processors, the Ryzen AI MAX+ 388 and Ryzen 7 9700X3D, both appeared i...
Khamis, 6 November 2025
TSMC to Implement 10% Price Hike, Future Chips Expected to Become Increasingly Expensive
TSMC is revamping its pricing strategy amid rising global demand for high-performance chips, set to ...
Isnin, 3 November 2025
Samsung Secures Tesla's AI6 Orders, AI5 Jointly Managed by Samsung and TSMC
Tesla and Samsung lead the shift towards diverse sourcing for advanced AI chips, prioritizing U.S. p...
Jumaat, 31 Oktober 2025