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AMD Strix Halo to Feature FP11 BGA Package, Comparable in Size to LGA 1700

kyojuro 7/11/2024

AMD brought the new Zen 5 series architecture to COMPUTEX 2024 and announced consumer processors that utilize the new architecture, including the Ryzen 9000 series for desktops and the Ryzen AI 300 series for mobile. The Ryzen AI 300 series is codenamed "Strix Point," and it was also announced early on that AMD has a large APU for mobile, codenamed "Strix Halo," aimed at enthusiast laptops.

Zen 5 Architecture

According to VideoCardz, the Strix Halo will use a BGA package called FP11 that measures 37.5 x 45 mm, which is almost the same size as the LGA 1700 package used in the Alder Lake-S and Raptor Lake-S processors. This size is approximately 60% larger than the FP8 package used in Phoenix and Strix Point processors (25 x 40 mm).

From previously leaked renders, the Strix Halo is designed in an MCM package with three chips, including two CCDs and a GCD. Its CPU part has up to 16 cores, and the GPU part is based on the RDNA 3.5/3+ architecture with 40 CUs. Each core of the Zen 5 architecture has 1MB of L2 cache, and each CCD has 8 cores and 32MB of L3 cache, totaling 16MB of L2 cache and 64MB of L3 cache. The two CCDs are connected to the GCD using the IF bus.

Additionally, the IOD is replaced by the GCD, an enlargement that integrates a more substantial core display, making the chip area significantly larger than the two CCDs combined. Alongside the GPU, there's an XDNA 2 architecture NPU with over 40 TOPS of arithmetic power, 32MB MALL Cache, and a 256-bit LPDDR5X memory controller inside. Sources indicate that the Strix Halo can support up to 128GB of LPDDR5X-8000 memory.

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